Assembly & Packaging Advanced Dicing Technologies Dicing Saws/ Blades & laser Scribing Systems + Peripherals. Takatori Corporation Vacuum, Lamination, Separation, Control & Information Processing, Transfer & Drive, Cutting, Cleanliness, Taping & De-taping Equipment for Grinding & Dicing Processes. Royce Instruments High precision testing machines for wire bond pull, ball bond shear, die shear, ball pull and stud pull. Pick and place machines for silicon. Thinky World Leader in the development and manufacturers of MIXERS. North Star Imaging NSI provides World Class Industrial Digital X-ray and 3D Computed Tomography Systems. KLA-Tencor High-Precision Mechanical Contact Profilers and Optical Profiler. VLSI Standards Leading supplier of NIST traceable calibration standards and calibration certificates. Insight K.K. IKK offers systems, services and training in the field of non-destructive testing technology (NDT). In particular, Insight specialised in non-destructive testing by using Ultrasound technology. Dynatex International Provides a complete line of die-singulation products for dry-icing, saw dicing, wafer bonding and wafer expanding processes. Sunny Instruments Provide a wide range of wafer dicing applications through a commitment to quality and superior service.