Wafer Protective Tape Lamination Machine

Takatori Team-100 ideal system for laminating tape within the circumference of the wafer prior to the backgrind process.
Takatori ATM-1100G is the ideal system for laminating tape to wafers, before the backgrind process.
Takatori ATM-1100K laminating DFR and B/G tape on wafers and its uniform lamination capability is the highest level in the market.
Takatori ATM-3000 is ideal system for laminating tape to wafers, before the backgrind process.
Takatori ATM-3000EF is ideal system for laminating tape to wafers, for the backgrind process and dry resist film lamination process.
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