Takatori Wafer Protective Tape Removal Machine

ATRM-2300
The ATRM-2300 is the ideal system for removing lamination tape from wafers, following the backgrind process.

ATRM-2200G
The ATRM-2200 is the ideal system for removing lamination tape from wafers, following the backgrind process.

TEAM-200
The TEAM-200 system for removing B/G tape from the wafer mounted to dicing frames, following the backgrind process.

ATRM-4000
Th ATRM-4000 system is for removing lamination tape from wafers, following the backgrind process