Compound Semiconductor

Advanced Dicing Technologies

Dicing Saws/ Blades & laser Scribing Systems + Peripherals.

Takatori Corporation

Vacuum, Lamination, Separation, Control & Information Processing, Transfer & Drive, Cutting, Cleanliness, Taping & De-taping Equipment for Grinding & Dicing Processes.

Royce Instruments

High precision testing machines for wire bond pull, ball bond shear, die shear, ball pull and stud pull. Pick and place machines for silicon.


World Leader in the development and manufacturers of MIXERS.

North Star Imaging

NSI provides World Class Industrial Digital X-ray and 3D Computed Tomography Systems.


High-Precision Mechanical Contact Profilers and Optical Profiler.

VLSI Standards

Leading supplier of NIST traceable calibration standards and calibration certificates.

Thin Film Stress Measurement Tool: NEW MODEL The industry standard in thin film stress analysis.

Provides a complete line of die-singulation products for dry-icing, saw dicing, wafer bonding and wafer expanding processes.

Insight K.K.

IKK offers systems, services and training in the field of non-destructive testing technology (NDT). In particular, Insight specialised in non-destructive testing by using Ultrasound technology.

Trebor International

High Purity Air Operated Diaphragm Pump and DI Water/ Chemical heater.

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