Fully Automatic Dry Liftoff Machine AMR-2200G
Removal of resist and unnecessary metal film on wafers is performed using a dry method.
Tape Transfer Machine
Performs both front to front and front to back tape transfer.
Tape is attached to the substrate in a vacuum, enabling bubble-free application. Pressure differential-based application method, there is no stress on the wafer.
Fully Automatic Package Mounter ATM-9000 Series
Attaches dicing tape to the substrate for dicing cutting of surface mount type chip LEDs.