Fully Automatic Dry Liftoff Machine AMR-2200G
Removal of resist and unnecessary metal film on wafers is performed using a dry method.


Tape Transfer Machine
Performs both front to front and front to back tape transfer.


Sapphire Substrate Mounter ATM-8100 Series
Tape is attached to the substrate in a vacuum, enabling bubble-free application. Pressure differential-based application method, there is no stress on the wafer.


Fully Automatic Package Mounter ATM-9000 Series
Attaches dicing tape to the substrate for dicing cutting of surface mount type chip LEDs.


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