Lamination pressure on and the temperature of whole wafer surface are uniformed.
Wafer alignment based on wafer circumference ensures accurate positioning without being affected by mounting accuracy.
Enables tenting, embedding, thick film, conformal, and gas seal attachment, according to unevenness conditions on the wafer surface.
Applicable to tenting lamination, embedding lamination, ultra-thick resist lamination, conformal lamination and gas hermetic lamination.
State-of-the-art design to maintain the integrigy of the lamination area and to achieve the best footprint.