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ATM-1100K
Lamination pressure on and the temperature of whole wafer surface are uniformed.

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TEAM-300
Wafer alignment based on wafer circumference ensures accurate positioning without being affected by mounting accuracy.

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VTM-300
Enables tenting, embedding, thick film, conformal, and gas seal attachment, according to unevenness conditions on the wafer surface.

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VTM-200M
Applicable to tenting lamination, embedding lamination, ultra-thick resist lamination, conformal lamination and gas hermetic lamination.

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ATM-3000EF
State-of-the-art design to maintain the integrigy of the lamination area and to achieve the best footprint.

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