Royce 650 Universal Bond Tester

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Royce 650 Universal Bond Tester

  • Motorized height controlled microscope that stays in focus as it moves
  • 305mm x 155mm stage for 300mm wafers, leadframes or substrates
  • Ultra Fine Pitch (UFP) capable
  • Image Capture Option, Field Upgradable
  • World Language support
  • Ribbon Bond testing for standard to high-power devices
  • Die shear up to 200 kgf
  • Robust test modules with range switching, on board calibration memory, and tool protection
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