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- Mounting minimum 150-micron thick and max 5 mm-warped wafers.
- No damage due to lamination roller on ultra thin and no air bubbles because of adopting vacuum chamber.
- To process thin warped wafers, correcting the warpage inside vacuum chamber.
- Memorizing tape tension to meet wide range of tapes.
- (Option) To process 50 micron thick wafers, equipping the pattern recognition alignment and loader for coin stack jar, and integration with B/G machine, Etching machine, DM-800A and TEAM-200.