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[tab title=”Features” id=”t1″]
- The footprint is smallest in the world despite the features of DAF lamination, mounting and BG tape removal.
- Standalone mode for ultra thin wafer.(Optional In-lining system with a grinder/polisher realizes the solution to the process of more ultra thin wafer)
- Vacuum chamber system is adopted for mounting wafers on dicing tape in order to avoid bubble generation between the tape and wafers as well as to minimize extra stress on the wafer surface. Either roll or precut type of dicing tape with DAF is applicable.
- DTM-812W is also line up with DDF laminating capability.