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Dicing Blades

ADT Hub Blade

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  • Best for materials such as Silicon, GaAs and other types of wafers as they have improved cut quality, longer blade life and higher UPH.

Dicing Blades (ADT Metal Sintered Blade)

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*Depends on diamond grit size

**Depends on blade thickness

Other thickness options, diameters, edge geometries and diamond grit size are available upon request

Use for a variety of soft and hard material applications 

  • This blade offers a range of applications 

    • Less wea/Higher Blade life​

    • Highly accurate blade dimensions

    • High precision dicing

    • Attractive cost - of - ownership

It is slower wear rate than Resin but faster than Nickel, Metal Sintered Blade are best suited for retaining package shape and size in application like: PBGA, Magnetic Heads, Optical Sensors & Communication, LTCC and QFN.

Dicing Blades (ADT Nickel Blades)

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*Depends on diamond grit size

**Depends on blade thickness and diamond grit size

***All special 2" Nickel Blades have an I.D of 40 mm

Other thickness options, diameters, edge geometries and diamond grit size are available upon request

The best choice for soft material and machinable hard material applications

  • ADT Nickel blades guarantee uniform distribution of diamonds through Nickel layer. Process not only allows for blades to be produced to very tight tolerances, but also permits optimization of grit size, hardness, and geometry to meet the requirements in different applications.

  • ADT Nickel Blades offers blades that have minimal burrs, produce superior cut quality, high throughput and longer blade life compared to standard Nickel Blades.

  • Applications like: PCB (Led Packages), PBGA, Multi- layer Capacitors, Ultrasound Sensors, Micro - positioners, Tape Heads and Magnetic Heads.

Dicing Blades (ADT Resin Blade)

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*Depends on diamond grit size

**Depends on blade thickness

Other thickness options, diameters, edge geometries and diamond grit size are available upon request

Use for hard and brittle material applications

  • This is good for self-sharpening matrix to expose new diamonds, have superior cut quality, best performance matrix for hard brittle and composite materials. Offers the widest variety of combinations for your most challenging applications, also giving high precision dicing with a cost- of - ownership.

  • Applications to be used like QFN, SAW Devices, Tape Heads, Optical Device, Fiber Optics and Hybrid Substrates and Ceramics Packages.