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Horizontal Grinding Machine: SGM-7000
SGM-7000

The best choice for grinding base materials, Splintery.

Sapphire, GaN, GaAs, SiC and various compound semiconductor wafer up to 4”.

Less damage back grinding than ever.

Available in SGM-8000, 9000 up to 6” available.

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Grinding
Lap/Polish
Lapping/Polishing Machine: SW-08/08P
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New Mechanism ensures circumference flatness of work pieces.

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Wafer Mount
Wafer DeM
Wafer Mounter: KBM-100
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The Bonding Machine

Equipped with Double independent Air Cylinders.

Taking into account the Safety Aspect.

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Wafer Demounter: SDK-300
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State of the ART DeMounter for thinned Wafer

'Clack free' 'Chipping free' 'Scratch free' Advanced demount solution.

All for wafer.

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