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Hardware Features

The 1.4 megapixel camera provides high resolution imaging at 1360 by 1040 pixel resolution. By switching the camera to ‘binning mode’ adjacent pixels are combined, doubling the imaging speed at 680 x 520 pixel resolution.


A 250 μm piezo actuator is included for high resolution scanning over a large Z range.


The five position turret holds objectives with magnifications ranging from 5x to 100x to support both micro- and macro-topography applications. The turret can be quickly removed to directly mount either a 2.5x or 5x objective. Calibrations keep your feature centered and focused when switching between objectives.


A solid state light source with green and white LEDs support PSI, VSI, and ZSI acquisition modes. LEDs provide a stable, long-life source of light, reducing the cost of ownership.


Motorized stages for the X-Y and Z-axis are standard on the MicroXAM-800. The X-Y stage has a range of 152 mm by 152 mm. The Z stage has a range of 125 mm, and supports an optional 76 mm offset block for taller samples. An optional theta stage has a range of 360°. The travel along all axis of motion is programmable with scripting.


Several sample holders are available to support a variety of sample types. Options include a simple flat surface, an optical bench layout, precision universal chucks (150 mm or 200 mm), and the solar chuck (156 mm x 156 mm). The chucks include locator pins for various sample configurations and a manual vacuum switch.


A Windows 7, 64-bit computer with a 23-inch widescreen monitor is standard. MS Office is included, enabling

direct copy-and-paste transfer of data from Helios to PowerPoint, Word, and Excel.