Discover how Millice Group showcased our semiconductor equipment line at SEMICON SEA 2025 and received the Best Distributor Award from THINKY Corporation.

Tresky Automation presents advanced die bonding and Active Alignment solutions supporting next-generation photonics and AI applications. As demand for high-performance computing and AI infrastructure continues to grow, technologies such as Co-Packaged Optics (CPO) and silicon photonics are becoming increasingly important. Tresky’s high-precision die bonders combined with Active Alignment capabilities enable accurate and reliable assembly of optical and photonic components. The systems support...

We are excited to return to PSCE 2025 for the second time and welcome visitors to Booth 200. Join us to explore our latest solutions, engage with our team, and discover how we can support your semiconductor and electronics needs.