Single Beam: Versatile IC Placement Platform (Fuzion 1-11)
Features
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Medium-Volume OEM, White Goods, Military, Medical
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30k - 45k line cph real throughput
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Rapid changeover with full feeder bank exchange, family setups
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User-friendly offline setup and validation with self-ID feeders
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390+ 8mm inputs, 40 random access tray inputs, track feeder support
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Large PCB size range: up to 508 x 635mm ( 20" x 25")
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Large component range: 01005 - 150mm
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Extensive component range overlap across all modules for easy balancing Leverage zero setup time with front/back changeover schemes, dynamic bank change, auto PCB support
Single Beam
Dual Beam
Dual Beam: Multi-function Placement Platform (Fuzion 2-14)
Features
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Best-in-class multi-function machine with fast placement of a wide component range for applications where flexibility and performance per line length are important
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Dual-beam, dual-drive overhead gantry system
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Two 7-spindle FZ7 placement heads
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Upward-looking vision system
Fuzion2-14B
30,750 cph
508 x 813mm
Dual Beam: Flexible, High Speed Placement Platform (Fuzion 2-60)
FuzionXC2-60
65,500 cph
610 x 1300mm
Dual Beam: High Speed, All-In-One Multi-function Machine (FuzionXC 2-37)
Quad Beam
Quad Beam: High Volume Placement Platform (Fuzion 4-120)
Features
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Pre-reflow – High Vol performance and Yield
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Finer density
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Full inspection
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Consistent Force
Platforms
Platforms: Odd-Form Assembly Platform(FuzionOF)
Platoform: High Accuracy Placement Platform for Semiconductor (FuzionSC)
