Toho Technology

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The FLX Series

Stress Measurement System:

– Provides accurate stress measurements on various films and substrate
– Precisely determines and analyzes surface stress on deposited thin films
– Ideal for research and development purposes
– Resolving problems such as metal and dielectric film cracking, voiding, and lifting formation
– Equipped with a heating element for stress monitoring at high temperatures
– Inert flush capability offers a controlled atmosphere in nitrogen or argon, preventing oxidation and moisture effects


KLA-Tencor’s patented Dual Wavelength Technology:
– Enables the system to select the wavelength most suitable for the particular application
– Pre-selecting the optimal wavelength minimizes destructive interference patterns from transparent films such as silicon nitride

Outstanding Software:
– The intuitive, Windows-based analysis software displays any combination of stress, time, surface deflection, or reflected light intensity measurements.


Automatics Wafer Mapping
FLX-2320-R : Sample size from 75mm to 200mm
FLX-3300-R : Sample size 200mm and 300mm

Thermal cycling from -65°C to 500°C
FLX-2320-S : Sample size from 75mm to 200mm
FLX-3300-S : Sample size 200mm and 300mm

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