High Precision Die Bonder

Designed for best Die Bonding performance in the semiconductor market, from prototyping to volume production, build on granite gantry for highest level of bonding accuracy.

​

(click image for sepcifications)

​

Modular Die Bonder

​Modularity designed to support a wide variety of Die Bonding process and applications through quick changeover between all bonding technologies that yields the best ROI in the market​

​

(click image for specifications)