Takatori | Millice

Features

Full Automatic Wafer Mounter with Minimum foot print in the world.
No damage due to lamination roller on ultra thin and no air bubbles because of adopting vacuum chamber.
Tension control for all types of tapes is possible, so the optimal coating can be achieved to match post-processing requirements.
Applicable for thin wafer

Features

Special controlled cutting along the wafer contour after tape lamination ensures the production of uniform and high precision taper laminates free from bubbles.
Special controlled cutting provides notched wafers and all-angle secondary flat positioned wafers.
Ensures lower running cost.
Without providing tape tension onto wafer, wafer does not have any stress after Back Grinding.

Features

Protective tape laminator for 12-inch (300 mm) wafers.
The partition between the wafer cassette and maintenance section minimizes the space for a clean room by putting the maintenance section outside the clean room.
Consideration for weight saving helps an operator from big burden.
Designed that tape is replaceable at the backside of the machine for easy management.
Interactive mode allows easier operation.
(Option) FOUP cassette, AGT and OHT protocol.

Lamination/ 8200

Features

Full automatic mounter for processing 12-inch (300 mm) wafers.
Mounting a wafer, and then removing protective tape.
No damage due to lamination roller on ultra thin and no air bubbles because of adopting vacuum chamber.
Operations for replacing tape and supplying frames are centralized on the back of the machine.
FOUP carrier. (option)
In-line docking with B/G device, etching and polishing devices.
Taking out wafers from a coin stacker

Features

Features

Protective tape remover for 12-inch (300 mm) wafers.
Partition between the wafer cassette and maintenance section minimizes the space for a clean room by putting the maintenance section outside the clean room.
Holding a wafer precisely with a unique wafer table and removing the protective tape without giving stress.
Interactive mode allows easier operation.
(Option) FOUP cassette, AGV and OHT protocol, built-in UV radiation unit.

Removal/ 12000

Features

Contactless mounting table which holds wafer at 3mm edge part. (Vacuum for wafer holding is not necessary.)
The adoption of a vacuum chamber system allows for reduced stress on the attachment rollers and the elimination of air bubbles, thereby preventing damage to the wafers and packages.
Tension control for all types of tapes is possible, so the optimal coating can be achieved to match post-processing requirements.
Automatic tape supply, tape coiling, wastage tape coiling, tape cutting.(UV tape applicable)
Applicable for thin wafer.