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Semi Auto (8 and 12)" Wafer Mounter Machine (SAM-8C)
Contactless mounting table which holds wafer at 3mm edge part. (Vacuum for wafer holding is not necessary.)
The adoption of a vacuum chamber system allows for reduced stress on the attachment rollers and the elimination of air bubbles, thereby preventing damage to the wafers and packages.
Tension control for all types of tapes is possible, so the optimal coating can be achieved to match post-processing requirements.
Automatic tape supply, tape coiling, wastage tape coiling, tape cutting.(UV tape applicable)
Applicable for thin wafer.
Fully Auto 8" Wafer Mounter Machine(ATM 8100TK)
Fully Auto 8" & 12" UV Irradiation Equipment for Tape Exfoliation (TUV 12)
Fully Auto 6” & 18” UV Irradiation Equipment for Tape Exfoliation (TUV 1)
Dicing tape UV Machie
8" Fully Auto Dry-Resist Film Laminator(TEAM 100ARF)
Dry Resist Laminators
12" Fully Auto Dry-Resist Film Laminator (TEAM 300A)
Fully Auto 8" TAIKO Wafer BG Tape Removal Machine (ATRM 2400TK)
BG tape removal machine
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