Takatori DFR Lamination Machine

DM-800B
The DM-800B is the ideal full-automatic system for laminating die sheet on 6″, 8″ 50μ thickness wafers.

 

DM-812
The DM-812 is the ideal system for laminating die attach sheet.

DAM-812M
This is semi-automatic machine for Dicing-Die bonding film (2 layers) for 8-12 inch wafer. And applicable for smaller wafer.