Takatori DFR Lamination Machine

The DM-800B is the ideal full-automatic system for laminating die sheet on 6", 8" 50μ thickness wafers.
The DM-812 is the ideal system for laminating die attach sheet.
This is semi-automatic machine for Dicing-Die bonding film (2 layers) for 8-12 inch wafer. And applicable for smaller wafer.
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