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![Logo of Takano](https://static.wixstatic.com/media/17ff97_9f1a23eb95064cd99b4f1ceea732d4b5~mv2.png/v1/crop/x_0,y_33,w_302,h_250/fill/w_199,h_165,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/Picture20_edited.png)
Non-Pattern Wafer Surface Particle Inspection System
![WM-10 Machine](https://static.wixstatic.com/media/17ff97_b0ee41fe35884208b0a4b97f4e6a3c56~mv2.jpg/v1/crop/x_0,y_12,w_392,h_464/fill/w_283,h_335,al_c,q_80,usm_0.66_1.00_0.01,enc_auto/WM-10.jpg)
Specifications
![Description of Specifications](https://static.wixstatic.com/media/17ff97_97c01fb846c44a84b3f2b19154dc6ba4~mv2.png/v1/fill/w_352,h_266,al_c,q_85,usm_0.66_1.00_0.01,enc_auto/Picture21.png)
Description
Optical imaging and measurement of particles on non-patterned wafer (bare or filmed) up to 300mm wafer size and 48nm high sensitivity. This is an ideal equipment for semiconductor process control and managing (verifying) pre/post system maintenance.
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