top of page
Logo of Takano
Non-Pattern Wafer Surface Particle Inspection System
WM-10 Machine

Specifications

Description of Specifications

Description 

Optical imaging and measurement of particles on non-patterned wafer (bare or filmed) up to 300mm wafer size and 48nm high sensitivity. This is an ideal equipment for semiconductor process control and managing (verifying) pre/post system maintenance.

bottom of page