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Wafer size up to 8 inch.
Takatori WSM-100 machine laminates double-sided tape onto wafers, remove cover film on it and attaches wafers and substrates.
Attachment of wafers and substrates is made in Takatori unique vacuum chamber.
- No air bubbles between wafers / substrates because of adopting vacuum chamber.
- Uniform attachment of uafers lsubstrates because of special press methood.
- Applicable for almost all tapes because of adopting tape tension control.