Tresky Automation presents advanced die bonding and Active Alignment solutions supporting next-generation photonics and AI applications. As demand for high-performance computing and AI infrastructure continues to grow, technologies such as Co-Packaged Optics (CPO) and silicon photonics are becoming increasingly important. Tresky’s high-precision die bonders combined with Active Alignment capabilities enable accurate and reliable assembly of optical and photonic components. Th

Date: 8 Jul 2024 Millice @ PSECE Millice will be attending the PSECE Semiconductor & Electronics Exhibition in the Philippines for the first time. We will be showcasing our latest technologies and introducing our new partners. Join us at our booth #108 from the 24th to 26th July 2024.