Millice at SEMICON SEA 2026

Millice was honoured to receive the “Long Term Partnership Award” at the recent THINKY Worldwide Distributor Meeting, recognizing over 20 years of partnership and collaboration. Presented to only four distributors globally, this award reflects our longstanding commitment to delivering innovative mixing solutions together with THINKY. We sincerely thank THINKY for their continued trust and support, and we look forward to many more years of partnership ahead.

Discover how Millice Group showcased our semiconductor equipment line at SEMICON SEA 2025 and received the Best Distributor Award from THINKY Corporation.

Tresky Automation presents advanced die bonding and Active Alignment solutions supporting next-generation photonics and AI applications. As demand for high-performance computing and AI infrastructure continues to grow, technologies such as Co-Packaged Optics (CPO) and silicon photonics are becoming increasingly important. Tresky’s high-precision die bonders combined with Active Alignment capabilities enable accurate and reliable assembly of optical and photonic components. Th