Discover how Millice Group showcased our semiconductor equipment line at SEMICON SEA 2025 and received the Best Distributor Award from THINKY Corporation.

Tresky Automation presents advanced die bonding and Active Alignment solutions supporting next-generation photonics and AI applications. As demand for high-performance computing and AI infrastructure continues to grow, technologies such as Co-Packaged Optics (CPO) and silicon photonics are becoming increasingly important. Tresky’s high-precision die bonders combined with Active Alignment capabilities enable accurate and reliable assembly of optical and photonic components. Th