Fully Auto 8" Wafer Mounter Machine
(ATM 8200A)
Features
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Full Automatic Wafer Mounter with Minimum foot print in the world.
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No damage due to lamination roller on ultra thin and no air bubbles because of adopting vacuum chamber.
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Tension control for all types of tapes is possible, so the optimal coating can be achieved to match post-processing requirements.
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Applicable for thin wafer
Fully Auto 8" BG Tape Lamination Machine
(ATM 1100G )
Features
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Special controlled cutting along the wafer contour after tape lamination ensures the production of uniform and high precision taper laminates free from bubbles.
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Special controlled cutting provides notched wafers and all-angle secondary flat positioned wafers.
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Ensures lower running cost.
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Without providing tape tension onto wafer, wafer does not have any stress after Back Grinding.
Fully Auto 12" BG Tape Lamination Machine(ATM 3100)
Features
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Protective tape laminator for 12-inch (300 mm) wafers.
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The partition between the wafer cassette and maintenance section minimizes the space for a clean room by putting the maintenance section outside the clean room.
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Consideration for weight saving helps an operator from big burden.
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Designed that tape is replaceable at the backside of the machine for easy management.
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Interactive mode allows easier operation.
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(Option) FOUP cassette, AGT and OHT protocol.
Fully Auto 8" Wafer Mounter Machine
(ATM 12000DR)
Features
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Full automatic mounter for processing 12-inch (300 mm) wafers.
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Mounting a wafer, and then removing protective tape.
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No damage due to lamination roller on ultra thin and no air bubbles because of adopting vacuum chamber.
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Operations for replacing tape and supplying frames are centralized on the back of the machine.
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FOUP carrier. (option)
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In-line docking with B/G device, etching and polishing devices.
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Taking out wafers from a coin stacker
Fully Auto 8"BG Tape Removal Machine (ATRM 2300)
Features
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Thin wafers down to 150 microns
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Warped wafer
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Every other cassette slot applicable
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Integrated UV unit(optional)
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Can be made to accommodate special wafers and special tapes
Fully Auto 12" BG Tape Removal Machine
(ATRM 4000A)
Features
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Protective tape remover for 12-inch (300 mm) wafers.
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Partition between the wafer cassette and maintenance section minimizes the space for a clean room by putting the maintenance section outside the clean room.
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Holding a wafer precisely with a unique wafer table and removing the protective tape without giving stress.
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Interactive mode allows easier operation.
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(Option) FOUP cassette, AGV and OHT protocol, built-in UV radiation unit.
Semi Auto (8 and 12)" Wafer Mounter Machine (SAM-8C)
Features
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Contactless mounting table which holds wafer at 3mm edge part. (Vacuum for wafer holding is not necessary.)
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The adoption of a vacuum chamber system allows for reduced stress on the attachment rollers and the elimination of air bubbles, thereby preventing damage to the wafers and packages.
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Tension control for all types of tapes is possible, so the optimal coating can be achieved to match post-processing requirements.
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Automatic tape supply, tape coiling, wastage tape coiling, tape cutting.(UV tape applicable)
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Applicable for thin wafer.
Fully Auto 8" Wafer Mounter Machine(ATM 8100TK)
Fully Auto 8" & 12" UV Irradiation Equipment for Tape Exfoliation (TUV 12)
Fully Auto 6” & 18” UV Irradiation Equipment for Tape Exfoliation (TUV 1)
8" Fully Auto Dry-Resist Film Laminator(TEAM 100ARF)
12" Fully Auto Dry-Resist Film Laminator (TEAM 300A)
Fully Auto 8" TAIKO Wafer BG Tape Removal Machine (ATRM 2400TK)
