TIM Measurement System
Description
TIM (Thermal Interface Material) measurement system, a system for the measurement of thermal conductivity of a wide range of thermal interface materials - grease, pads, foils, etc. - with a measurement range of of roughly 0.1 to 500W/m-K.
Specifications
Thermal Test Chip/Board
Thermal Test Chip
Description:
The TTC-1001 Thermal Test Chip is based on a 1mm X 1mm Unit Cell and is designed to provide a maximum of flexibility for thermal characterization of semiconductor packages. Each Unit Cell can be used individually or in a square or rectangular array
Thermal Test Boards
Description:
Thermal Test Boards - a series of thermal test boards for package characterization and design comparison that conform to to the JEDEC JESD51 standards.
Thermal Test Vehicles & Load Board
Thermal Test Vehicles
Description:
Thermal Test Vehicles (TTV) in flip-chip, bare die, BGA packages for a variety of thermal simulation, reliability, qualification, heat sink characterization, and TIM characterization activities. Selective unused balls are sequentially connected together for daisy-chain applications
Thermal Load Board
Description:
Thermal Load Board (TLB) is used to simulate an application printed circuit assembly (PCA) either before all the heat-producing components are available for mounting on the application PCA or if the heat-producing components require complex electronic circuitry to create heat within the components
Thermal Measurement Systems (TMS)
PROCESS OVERVIEW
Description
Thermal Measurement Systems (TMS) are automated systems for measurement of thermal impedance and resistance of semiconductor packages, thermal interface materials (TIM), heat sinks, vapor chamber heat spreaders, heat pipes and various cooling solutions, using TTC/TTV, with extended power cycling capability for TIM reliability and stability measurements, under application-oriented measurement conditions.
COMPONENTS
Thermal Test Vehicles
TTV-410X Board
