The DXB-880 Wafer Bonder is an automated system for void-free wafer bonding, supporting applications like wafer thinning, dicing, and metal plating. It offers precise control over temperature, pressure, and duration, with password-protected settings and real-time progress display. Active cooling reduces cooling times to 6-10 minutes, while the dual-chamber design prevents air entrapment in the bondline. With a temperature range of 100-356°F, cycle times from 1 minute to 10 hours, and compact dimensions, the DXB-880 combines precision and ease of use for versatile bonding processes.

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• Chamber size: 11 inches in diameter.

• Temperature range: 100-356°F (40-180°C).

• Cycle time: 1 minute to 10 hours.

• Power: Requires 100/120 or 220/240 VAC depending on the model.

• Vacuum: Two independent supplies at 25 inHg.

• Coolant: Water flow of 12 liters per minute at 40 psi.

• Environmental conditions: 60-80°F, 0-95% humidity (non-condensing)​